Paper
14 May 2007 Process latitude dependency on local photomask haze defect in 70-nm binary intensity mask
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Abstract
The crystal growth and haze formation on the reticle continue to be significant problems for the semiconductor industry. Recently, a pattern size has gradually reduced to enhance the integration of semiconductor device. As minimum linewidth has shrunk, the exposure wavelength has also progressively shrunk. The exposure wavelengths have been reduced progressively from g-line (436 nm), i-line (365 nm), KrF (248 nm), to ArF (193 nm). However, expose wavelength shrink caused some serious problems. One of the problems to be solved is growing defect in the reticle during the process. This growing defect on the reticle is called the haze. The haze is formed on both sides of the reticle, on the quartz side of the mask and on the chrome side of the mask. In this investigation, we varied the local haze defect size and the characteristics of the haze defect. And we get the critical dimension and the exposure latitude variation as the haze transmission changes and the haze phase shifts.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Young-Min Kang, Sung-Jin Kim, Jin-Back Park, Wook Chang, Seung-Wook Park, Jai-Soon Kim, Han-Koo Cho, and Hye-Keun Oh "Process latitude dependency on local photomask haze defect in 70-nm binary intensity mask", Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 660720 (14 May 2007); https://doi.org/10.1117/12.728983
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KEYWORDS
Air contamination

Photomasks

Phase shifts

Electroluminescence

Binary data

Reticles

Semiconducting wafers

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