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14 May 2007 Reduction of resist heating effect by writing order optimization: part II
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Proceedings Volume 6607, Photomask and Next-Generation Lithography Mask Technology XIV; 660721 (2007) https://doi.org/10.1117/12.728984
Event: Photomask and Next-Generation Lithography Mask Technology XIV, 2007, Yokohama, Japan
Abstract
This paper presents an experimental study of resist heating effect in mask making with a variable shaped electron beam mask writer. Experiments were performed at current densities of 40 and 80 A/cm2 on mask blanks with a chemically amplified resist. At these levels of current density, the critical dimension change due to resist heating effect was obvious. The critical dimension change was reduced with a checkerwise writing method, in which sub-fields were arranged in main fields in an alternate fashion so that the average incoming heat per unit area due to beam exposure could be reduced. The reduction factor was 2 or more.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazuya Goto, Kazutaka Watakabe, Tadashi Komagata, and Yasutoshi Nakagawa "Reduction of resist heating effect by writing order optimization: part II", Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 660721 (14 May 2007); https://doi.org/10.1117/12.728984
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