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18 June 2007 Improving the measurement of thick and thin films with optical profiling techniques
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Abstract
Optical profiling techniques, mainly confocal and white light interferometry, have demonstrated to be suitable techniques for characterization of transparent thick films. Measurements are carried out by vertically scanning the upper and lower film interfaces. Thickness of the layer is determined from the two peaks in the confocal axial response or from the two sets of interference fringes developed during the vertical scan. The 3D topographies of the upper and lower interfaces of the film can also be obtained. Measurements of photoresists or oxide coatings are typical examples of thick film characterization. On the other hand, measurement of thin films is considered to be a very difficult application to carry out with most optical imaging profilers. A film should be considered as thin when the two peaks obtained along the vertical scan become unresolved. We introduce new methods based on confocal techniques, which make it possible to measure sub-micrometric layers on structured samples. These techniques are based on the comparison between the axial responses obtained in areas where the film is present and those in other areas where only the substrate is present. This method has been successfully used for thickness assessment of several samples, such as a set of calibrated Si-SiO2 layers.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cristina Cadevall, Carles Oriach-Font, Roger Artigas, Agustí Pintó, and Ferran Laguarta "Improving the measurement of thick and thin films with optical profiling techniques", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66161Z (18 June 2007); https://doi.org/10.1117/12.726187
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Cited by 3 scholarly publications.
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KEYWORDS
Confocal microscopy

Semiconducting wafers

Thin films

Silicon

Objectives

Blue light emitting diodes

Interfaces

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