18 June 2007 Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)
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Abstract
In this study, behavior of ball grid arrays (BGA) under external cycling loading was studied. A loading system for inducing cycling stress to BGA was successfully built. Dynamic electronic speckle pattern interferometry (DESPI) with in-plane sensitivity and Hilbert transform for phase analysis was applied. The cycling deformation of one solder ball was measured continuously. Temporal, whole-field deformation on one solder ball was demonstrated.
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Violeta Dimitrova Madjarova, Violeta Dimitrova Madjarova, Satoru Toyooka, Satoru Toyooka, Hiroyuki Chida, Hiroyuki Chida, Hirofumi Kadono, Hirofumi Kadono, } "Stress behavior of ball grid array (BGA) studied by dynamic electronic speckle pattern interferometry (DESPI)", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66162R (18 June 2007); doi: 10.1117/12.726094; https://doi.org/10.1117/12.726094
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