Paper
18 June 2007 Application of reflection hologram interferometry with a high resolution to residual stresses characterisation by local material removing
Vladimir S. Pisarev, Vitaly V. Balalov
Author Affiliations +
Abstract
Residual stresses determination in thin-walled structures by combining the hole drilling method and reflection hologram interferometry is considered as a tool with some unique properties in the field of industrial inspection. The relations used for converting experimentally derived parameters into stress values of interest are presented. Required input data are obtained by simultaneous measurements of probe hole distortions in two principal strain directions on opposite sides of thin plane specimen. Emphasis is made on obtaining high-quality interferograms with high fringe density around small probe hole drilled in residual stress field. Such fringe patterns are capable of describing residual stress components of high level in a presence considerable stress gradients. It is shown that a resolution of ten fringes can be achieved over a hole of 1.5 mm diameter. Practical implementing developed technique is illustrated in the course of residual stresses characterisation near different welded joints of thin aluminium plates.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vladimir S. Pisarev and Vitaly V. Balalov "Application of reflection hologram interferometry with a high resolution to residual stresses characterisation by local material removing", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66162T (18 June 2007); https://doi.org/10.1117/12.726241
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KEYWORDS
Fringe analysis

Holograms

Holographic interferometry

Interferometry

Aluminum

Superposition

Aerospace engineering

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