Flexible optical wire-bonding for planar lightwave circuits packaging

Roberto R. Panepucci; Abdullah J. Zakariya; Tao Liu

doi:10.1117/12.734927

11 September 2007 Flexible optical wire-bonding for planar lightwave circuits packaging

Roberto R. Panepucci, Abdullah J. Zakariya, Tao Liu

Proceedings Volume 6645, Nanoengineering: Fabrication, Properties, Optics, and Devices IV; 66450D (2007) https://doi.org/10.1117/12.734927
Event: NanoScience + Engineering, 2007, San Diego, California, United States

Abstract

A platform that enables optical coupling from fiber-ribbon connectors to planar lightwave circuits (PLCs) is described. Flexible optical waveguides are used to form a variable length directional coupler that inserts and extracts light from a waveguide located arbitrarily inside the chip. The contact length can be adjusted for optimal coupling allowing manufacturing variation in materials, widths and cladding thicknesses present on a chip. This approach may be ideal for packaging WDM devices as the 3dB bandwidth of the coupling covers the whole 1300 -1700 nm fiber-optic telecommunication range. Coupling length control in the range of 0.05-0.2 μm leads to maximum coupling in excess of 80% for the range of conditions investigated. Simulations of the performance are discussed and initial fabrication and optical coupling results are presented.

Citation Download Citation

Roberto R. Panepucci, Abdullah J. Zakariya, and Tao Liu "Flexible optical wire-bonding for planar lightwave circuits packaging", Proc. SPIE 6645, Nanoengineering: Fabrication, Properties, Optics, and Devices IV, 66450D (11 September 2007); https://doi.org/10.1117/12.734927

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