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17 September 2007 Athermal bonded mounts: incorporating aspect ratio into a closed-form solution
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Abstract
Several approaches have been used to calculate a closed-form solution for the athermal bond thickness for mounting optical elements. All of the previously developed closed-form solutions use the assumption that the bondline is thin with respect to the width of the bond in the axial direction. While this assumption is mathematically convenient, it is not empirically or theoretically supported. To compensate for the inaccuracies of these closed-form solutions, recent research using test data and finite element analysis has centered on generating empirically determined correction factors that are applied to the closed-form solutions for a zero-stress bond. In this paper an alternative closed-form solution that incorporates the bond aspect ratio is presented. The values generated from this formula are compared to the empirical results of a finite element analysis (FEA) study. An example case is used to compare the results provided by the different methods for calculating the ideal bond thickness.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher L. Monti "Athermal bonded mounts: incorporating aspect ratio into a closed-form solution", Proc. SPIE 6665, New Developments in Optomechanics, 666503 (17 September 2007); https://doi.org/10.1117/12.730275
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