20 September 2007 Measurement of thermal contact conductance of SPring-8 beamline components
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Abstract
Direct cooling is adopted for most high heat load components in SPring-8 beamlines. On the other hand, contact cooling is employed for some components such as a graphite filter, aluminum filter, mirror, and cryogenic monochromator silicon crystal. For the thermal design of the contact cooling components, it is important to obtain reliable thermal contact conductance value. The conductance depends on many parameters such as the surface materials, surface roughness, flatness of the surface, interstitial materials, temperature of the contact surface, and contact pressure. An experimental setup is fablicated to measure the conductance at liquid nitrogen temperature and room temperature. The thermal contact conductance of a Si-Cu interface and that of a Si-In-Cu interface are measured at cryogenic temperature at contact pressures ranging from 0.1-1.1 MPa. The conductance of an Al-Cu interface and that of a graphite-Cu interface are measured using gold and silver foils as interstitial materials. The measurements are performed at room temperature and at pressures ranging from 0.5-4 MPa. The experimental setup and the results obtained are presented.
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Tetsuro Mochizuki, Haruhiko Ohashi, Mutsumi Sano, Sunao Takahashi, Shunji Goto, "Measurement of thermal contact conductance of SPring-8 beamline components", Proc. SPIE 6705, Advances in X-Ray/EUV Optics and Components II, 67050U (20 September 2007); doi: 10.1117/12.735397; https://doi.org/10.1117/12.735397
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