21 November 2007 Residual stresses around femtosecond laser ablated grooves in silicon wafer evaluated by nanoindentation
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Proceedings Volume 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 672417 (2007) https://doi.org/10.1117/12.782835
Event: 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes, 2007, Chengdu, China
Abstract
As an excellent micromachining method, femtosecond laser ablation is more and more frequently used in micromachining. Femtosecond laser ablation can take residual stresses beside the machining area, which may affect the performance of micro devices. In this paper, grooves were ablated by femtosecond laser and nanoindentation experiments were exploited to uncover residual stresses in the area beside the grooves. The reduced modulus and hardness in different areas around the groove were measured through nanoindention and position dependent regular changes in reduced modulus were found. Such changes contained the information of residual stresses in such area. A formula correlating residual stresses with the reduced modulus was set up.
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Yongzhi Cao, Yongzhi Cao, Yanshen Wang, Yanshen Wang, Shen Dong, Shen Dong, Yanqiang Yang, Yanqiang Yang, Yingchun Liang, Yingchun Liang, Tao Sun, Tao Sun, } "Residual stresses around femtosecond laser ablated grooves in silicon wafer evaluated by nanoindentation", Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 672417 (21 November 2007); doi: 10.1117/12.782835; https://doi.org/10.1117/12.782835
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