30 October 2007 Shuttle fabrication for designs with lifted I/Os
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Proceedings Volume 6730, Photomask Technology 2007; 67305C (2007); doi: 10.1117/12.743377
Event: SPIE Photomask Technology, 2007, Monterey, California, United States
Abstract
The mask set for a shuttle run (multi-project wafer) may contain designs using different number of metal layers. Wafers fabricated with k metal layers can only yield dice for the designs using only k metal layers. This results in considerable waste of wafers. In this paper we propose a simple concept called Lifted-I/O (LIO) to address this problem. LIO elevates the I/Os of all designs to the highest metal layer possibly used in a shuttle run. Our study shows that a shuttle run with LIO for low-volume production is marginally better than that without LIO. However, the margin increases as production volume increases. For a production volume up to a few ten thousand dice per design, a shuttle run with LIO could pay up to 11% less, which corresponds to about 400 thousand dollars.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rung-Bin Lin, Meng-Chiou Wu, Shih-Cheng Tsai, "Shuttle fabrication for designs with lifted I/Os", Proc. SPIE 6730, Photomask Technology 2007, 67305C (30 October 2007); doi: 10.1117/12.743377; https://doi.org/10.1117/12.743377
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KEYWORDS
Semiconducting wafers

Metals

Reticles

Photomasks

Wafer dicing

Lithography

Product engineering

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