21 November 2007 Reliability study in the fabrication and packaging of optical devices
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Proceedings Volume 6781, Passive Components and Fiber-based Devices IV; 67811N (2007) https://doi.org/10.1117/12.743239
Event: Asia-Pacific Optical Communications, 2007, Wuhan, China
Abstract
There are two approaches to develop reliable photonic devices. One is by the process & materials optimization, and the other is the reliability assurance during the fabrication, packaging & operation period. These critical issues needed to be addressed in order to bring commercialization of these devices closer. The development of organic polymers with high optical quality & high performance has led to a maturing of the polymer photonic device field. The combination of structural flexibility and toughness in optical polymers also makes it more suitable for vertical integration to realize 3D and even for all-polymer integrated optics. Packages are usually an integral part of the device. Therefore, fabrication, packaging and reliability challenges are the well-known potential showstopper to the growth of photonic components. In this review, the suitability of optical polymer systems, the materials & process optimization issues in fabricating reliable planner lightwave circuit (PLC) devices, packaging of fiber array & splitter components to integrate fiber-to-waveguide devices for fiber-to-the-home (FTTH) networks are summarized.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. P. Chan, H. P. Chan, M. A. Uddin, M. A. Uddin, } "Reliability study in the fabrication and packaging of optical devices", Proc. SPIE 6781, Passive Components and Fiber-based Devices IV, 67811N (21 November 2007); doi: 10.1117/12.743239; https://doi.org/10.1117/12.743239
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