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15 November 2007 Fast alignment of marks in COG bonding based on multi-resolution
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Proceedings Volume 6786, MIPPR 2007: Automatic Target Recognition and Image Analysis; and Multispectral Image Acquisition; 67862K (2007) https://doi.org/10.1117/12.751681
Event: International Symposium on Multispectral Image Processing and Pattern Recognition, 2007, Wuhan, China
Abstract
COG (chip on glass) bonding is widely used in LCD industry. The alignment of marks in COG bonding needs high precision and reliability. It is of utmost importance to find two marks in COG fast and exactly. Its key technique is to use the advanced optical system to get the two-marked positions of chip on the glass and to use the PLC procedure control to complete the automatic alignment A series of experiments are performed to test the algorithms proposed, which show that the fast alignment of marks in COG bonding based on multi-resolution is both rational and highly effective.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hui Geng, Hanyu Hong, Yan Zhang, and Zhimin Lin "Fast alignment of marks in COG bonding based on multi-resolution", Proc. SPIE 6786, MIPPR 2007: Automatic Target Recognition and Image Analysis; and Multispectral Image Acquisition, 67862K (15 November 2007); https://doi.org/10.1117/12.751681
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