Design method and stress analysis on bioprosthetic heart valve

Quan Yuan; Chengrui Zhang; Xiusheng Chen; Xiaowei Wang

doi:10.1117/12.783864

9 January 2008 Design method and stress analysis on bioprosthetic heart valve

Quan Yuan, Chengrui Zhang, Xiusheng Chen, Xiaowei Wang

Proceedings Volume 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials; 67943D (2008) https://doi.org/10.1117/12.783864
Event: ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 2007, Gifu, Japan

Abstract

This paper reports the geometrical design method of bioprosthetic heart valve and stress distribution of leaflets with different shapes based on the theory of Membrane and finite element analysis method. According to Membrane theories, we construct the geometrical parametric model of bioprosthetic heart valve to achieve the efficiency of the natural heart valves of human. Combining traditional design theories and modern design methods, we create the paraboloid, spherical curved surfaces in accordance with the geometrical equations in the appropriate frame ordinal. Based on the stress analysis of two kinds of curved surfaces, we take turns to create relative inverse conic curved surfaces which satisfy the actual condition. Meanwhile, the space positions of boundary curves and important points are determined by the intersected curves and axis of revolution. Geometrical design and the Finite Element analysis could provide direct and useful information for the bioprosthetic-heart-valve designer.The experimental result of the finite element analysis reveal that the force distribution of sphere valves leaflets is comparatively reasonable. We also find that paraboloid valves leaflets have such obvious features of stress concentration and non-uniform force distribution. Therefore, mechanical properties of spherical valves leaflets are superior to those of paraboloid valves leaflets.

Citation Download Citation

Quan Yuan, Chengrui Zhang, Xiusheng Chen, and Xiaowei Wang "Design method and stress analysis on bioprosthetic heart valve", Proc. SPIE 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 67943D (9 January 2008); https://doi.org/10.1117/12.783864

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