9 January 2008 Analysis of data reliability and stability in HR-SDN communication module
Author Affiliations +
Proceedings Volume 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials; 67944U (2008) https://doi.org/10.1117/12.784106
Event: ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 2007, Gifu, Japan
Abstract
Profibus is open industrial communication system for wide range of applications in manufacturing and process automation. In Profibus, FDL service use to need hard real-time system. In these systems required data reliability and stability and real-time feature. Profibus fieldbus networks used in many industrial fields because of it supports real-time industrial communication. So we analyze of data reliability and stabilization in profibus network. In this paper, there was to a station for communication which uses FDL from in the communication module which is used a data transfer possibility at once, and from communication period (ex. 10ms) it analyzed the system effect which it follows in transmission lag occurrence element and a data transfer error ratio it analyzed. Like this analytical result it led and there were from transmission for reliability and data stability they confirmed to HR-SDN communication modules and a guarantee yes or no. In this paper, we try to analysis of transmission delay ability for satisfaction data reliability and stability in specific system, which requested real-time feature. And, we analysis system reconstruction time and data delay time according to data/token packet loss. Packet-error occur physical layer in Profibus. As a result of above analysis, we propose method of enhancement of reliability in system which requested system reliability and stability. And, we confirm proposed method.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dong-Hee Choi, Jin-Chul Shin, Hong-Seong Park, "Analysis of data reliability and stability in HR-SDN communication module", Proc. SPIE 6794, ICMIT 2007: Mechatronics, MEMS, and Smart Materials, 67944U (9 January 2008); doi: 10.1117/12.784106; https://doi.org/10.1117/12.784106
PROCEEDINGS
6 PAGES


SHARE
Back to Top