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26 September 2007 Comparison of different LED Packages
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Proceedings Volume 6797, Manufacturing LEDs for Lighting and Displays; 67970I (2007) https://doi.org/10.1117/12.758944
Event: Manufacturing LEDs for Lighting and Display, 2007, Berlin, Germany
Abstract
In this paper different technologies for LED packaging are compared, focusing on Chip on Board (COB) and SMD technology. The package technology which is used depends on the LED application. A critical fact in LED technology is the thermal management, especially for high brightness LED applications because the thermal management is important for reliability, lifetime and electrooptical performance of the LED module. To design certain and long life LED applications knowledge of the heat flow from LEDs to the complete application is required. High sophisticated FEM simulations are indispensable for modern development of high power LED applications. We compare simulations of various substrate materials and packaging technologies simulated using FLOTHERM software. Thereby different substrates such as standard FR4, ceramic and metal core printed circuit boards are considered. For the verification of the simulated results and the testing of manufactured modules, advanced measurement tools are required. We show different ways to experimentally characterize the thermal behavior of LED modules. The thermal path is determined by the transient thermal analysis using the MicReD T3Ster analyzer. Afterwards it will be compared to the conventional method using thermocouples. The heat distribution over the module is investigated by an IR-Camera. We demonstrate and compare simulation and measurement results of Chip-on-Board (COB) and Sub-Mounted Devices (SMD) technology. The results reveal that for different applications certain packages are ideal.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henning Dieker, Christian Miesner, Dirk Püttjer, and Bernhard Bachl "Comparison of different LED Packages", Proc. SPIE 6797, Manufacturing LEDs for Lighting and Displays, 67970I (26 September 2007); https://doi.org/10.1117/12.758944
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