21 December 2007 Reliability evaluation for solder joints in embedded electronic package
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Abstract
When the design engineers discuss the new concept of the embedded electronic packaging, there are a lot of kinds of materials on the list, the resins, silicones, and so on. Therefore, it is very important to study and understand the basic effect of the new materials on the important components of their products at the early stage. In the study, the authors used simulation approach to investigate several different concepts of the embed package, and the focus is the effect of the important components. Based upon the analytical results, the advantage and demerit of each concept were discussed.
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Masashi Yamabe, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi, Masaki Shiratori, Hideki Ohhashi, "Reliability evaluation for solder joints in embedded electronic package", Proc. SPIE 6798, Microelectronics: Design, Technology, and Packaging III, 67980S (21 December 2007); doi: 10.1117/12.759410; https://doi.org/10.1117/12.759410
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