7 January 2008 The design of a new concavity heat sink for the high power semiconductor laser array
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In this paper, we will present the new structure of the concavity heat sink with flower water in the pipe for semiconductor laser array. In the CW operation, the main equations of controlling temperature and boundary conditions are described in the concavity heat sink. The static thermal conduction equation that govern heat flow in the high power laser array and the heat sink is given. The variational equation integral of equation has been described according the boundary conditions based on Finite Element Method. The process of solving the equation is included and the distribution of temperature in the concavity heat sink is studied. The virtues of concavity heat sink comparing with the rectangle heat sink are showed. We also design the thickness of the concavity heat sink. The difference of the concavity heat sink and the rectangle heat sink will be presented. The result shows that the maximum temperature in the heat sink and the temperature grads especially in the corner of heat sink are dropped and this heat sink is best fit for the heat leaving off the laser array.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hong-Dong Zhao, Hong-Dong Zhao, Mei Sun, Mei Sun, Hong-Li Tian, Hong-Li Tian, Jin-Qin Wang, Jin-Qin Wang, } "The design of a new concavity heat sink for the high power semiconductor laser array", Proc. SPIE 6824, Semiconductor Lasers and Applications III, 68241C (7 January 2008); doi: 10.1117/12.756649; https://doi.org/10.1117/12.756649


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