Preparation and property study of gold-tin alloys for packaging of high-power semiconductor lasers

Bo Huang; Jinqiang Chen; Zhongliang Qiao; Chunling Liu; YanPing Yao; Xin Gao; Baoxue Bo

doi:10.1117/12.756839

7 January 2008 Preparation and property study of gold-tin alloys for packaging of high-power semiconductor lasers

Bo Huang, Jinqiang Chen, Zhongliang Qiao, Chunling Liu, YanPing Yao, Xin Gao, Baoxue Bo

Proceedings Volume 6824, Semiconductor Lasers and Applications III; 68241E (2008) https://doi.org/10.1117/12.756839
Event: Photonics Asia 2007, 2007, Beijing, China

Abstract

A novel fabrication method and process of Au(80wt.%)-Sn(20wt.%) eutectic alloys solder with excellent thermal, electrical and mechanical properties and relatively low melting and reflow temperature was presented, the characteristic of gold-tin alloy solder and the key technique to realize highly reliable bonding were discussed.

Citation Download Citation

Bo Huang, Jinqiang Chen, Zhongliang Qiao, Chunling Liu, YanPing Yao, Xin Gao, and Baoxue Bo "Preparation and property study of gold-tin alloys for packaging of high-power semiconductor lasers", Proc. SPIE 6824, Semiconductor Lasers and Applications III, 68241E (7 January 2008); https://doi.org/10.1117/12.756839

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