Paper
20 November 2007 Online non-contact detection for LED chips
Ping Li, Lian Li, Jing Wen, Yumei Wen
Author Affiliations +
Abstract
An online non-contact fault detection technique of LED chips is presented based on the photovoltaic effect in diodes. By observing the current in the bonding lead frame of a LED chip, which is induced by illuminating the chip, the LED chip and its electric connection with the lead frame during packaging are checked. The fault detection principle is described in detail in this paper. Red, yellow and green LED chips are tested in the experiment. The experimental results show that the method can be easily realized, and thus can be used for online fault detection of LED chips in packaging.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ping Li, Lian Li, Jing Wen, and Yumei Wen "Online non-contact detection for LED chips", Proc. SPIE 6828, Light-Emitting Diode Materials and Devices II, 68280X (20 November 2007); https://doi.org/10.1117/12.760235
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KEYWORDS
Light emitting diodes

Lead

Packaging

Signal detection

Electrodes

Magnetism

Photovoltaic detectors

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