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28 November 2007 Automatic optical inspection for chip components based on local principal wave probability
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An automatic optical inspection algorithm for chip components which is based on local principal wave probability is presented. The gray-level change of component image in local feature region is used as a detection criterion. By introducing local principal wave probability, the similarity between sample image and inspected image is described by intrinsic characteristic of the principal wave. Thus it can be decided whether the component is a defective one. Furthermore the type of defect can also be concluded. Experimental results show that the algorithm can be real-time by reducing the computation from the whole image to local region. It solves the problem of high sensitivity to position of component that exists in the algorithms widely used in automatic optical inspection for chip components.
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Jianjie Wu, Feng Sun, and Yongxin Wang "Automatic optical inspection for chip components based on local principal wave probability", Proc. SPIE 6833, Electronic Imaging and Multimedia Technology V, 683307 (28 November 2007);


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