28 November 2007 Simultaneous defect inspection on the surface and in the interior of bare wafers using a simple knife-edge test
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Abstract
This paper proposes a new, simple, high-speed wafer-inspection method using a knife-edge approach. This method basically corresponds to a bright-field microscope except the light reflected from the wafer surface is partially cut by a knife-edge, which increases edge contrast in the cutting direction. In addition, the knife-edge test does not depend on the light wavelength and thus the light can have any wavelength as far as it is reflected by the wafer surface. Therefore, the knife-edge test, which uses visible light, can be employed simultaneously with a looking through inspection technique, which uses infra-red, with a single white-light source. The knife-edge method in tandem with a looking through inspection is implemented at a laboratory level and preliminary experimental results demonstrating edge enhancement are presented.
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Jun Ho Lee, Yongmin Kim, Jinseoub Kim, Yeong-eun Yoo, "Simultaneous defect inspection on the surface and in the interior of bare wafers using a simple knife-edge test", Proc. SPIE 6834, Optical Design and Testing III, 683417 (28 November 2007); doi: 10.1117/12.747730; https://doi.org/10.1117/12.747730
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