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24 January 2008 Innovative on-chip packaging applied to uncooled IRFPA
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Abstract
The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI develops an onchip packaging technology dedicated to microbolometers. The efficiency of a micropackaging technology for microbolometers relies on two major technical specifications. First, it must include an optical window with a high transmittance for the IR band, so as to maximize the detector absorption. Secondly, in order to preserve the thermal insulation of the detector, the micropackaging must be hermetically closed to maintain a vacuum level lower than 10-3mbar. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This zero level packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.
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Geoffroy Dumont, Agnès Arnaud, Pierre Imperinetti, Eric Mottin, François Simoens, Claire Vialle, Wilfried Rabaud, Gilles Grand, and Nathalie Baclet "Innovative on-chip packaging applied to uncooled IRFPA", Proc. SPIE 6835, Infrared Materials, Devices, and Applications, 68350G (24 January 2008); https://doi.org/10.1117/12.756719
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