Translator Disclaimer
8 January 2008 Analysis of the thermal stress of IRFPA assembly using FEM
Author Affiliations +
Abstract
Thermal stress is a common problem as for the cryogenic IRFPA (Infrared Focal Plane Array) Assembly, especially when the assembly is in large scale. The stress is generated when the assembly enduring times of temperature cycling ranging from 80K to 300K approximately. This huge temperature change and the mismatch of the CTE (coefficient of thermal expansion) between these materials by which the assembly is made results in severe thermal stress in the IRFPA. This thermal stress is the main reason for the failure of assembly during temperature cycling such as the degradation of device performance and even the die crack. To improve the reliability of the FPA assembly reducing the thermal stress becomes a more important issue. This article presents several results of the analysis of the thermal stress of IRFPA assembly using FEM (Finite Element Method). According to this result we have got an optimal design of the assembly structure.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Haiyan Zhang and Huajie Lu "Analysis of the thermal stress of IRFPA assembly using FEM", Proc. SPIE 6835, Infrared Materials, Devices, and Applications, 68350J (8 January 2008); https://doi.org/10.1117/12.757438
PROCEEDINGS
5 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

The study of selective heating of indium bump in MCT...
Proceedings of SPIE (October 14 2012)
Thermal Imaging Using Silicon
Proceedings of SPIE (December 06 1988)
Collective flip-chip technology for hybrid focal plane arrays
Proceedings of SPIE (December 14 2000)
Collective flip-chip technology for HgCdTe IRFPA
Proceedings of SPIE (September 24 1996)

Back to Top