4 January 2008 Experimental study on roughness and flatness of micromirror fabricated by different anisotropic silicon etching processes
Author Affiliations +
Abstract
Fabrication of flat, free-standing silicon diaphragms as micromirrors using etching processes is the key in the development of optical Micro-Elecro-Mechanical System(MEMS) devices, such as tunable F-P(Fabry-Perot) filters. It is very important for etching process to get smooth surface and uniform depth because they greatly affect the performance of the final device. In this paper, we report the experimental results about roughness and flatness of silicon micromirror fabricated by wet and dry etching processes. The investigated process involved wet-etching process in self-prepared KOH solution, and dry etching process with such machines as ALCATEL 601E DRIE(Deep Reactive Ion Etching) and STS ICP (Inductivity Coupling Plasma). It was found that wet etching process could supply more uniform etching depth, whereas the better surface roughness was gotten by dry etching. For a 30μm target depth, surface roughness less than 3-nm and maximal depth difference less than 0.3-μm were obtained by STS ICP and KOH respectively.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jing Xu, Jing Xu, Zhanxi Huang, Zhanxi Huang, Xiaoxin Xu, Xiaoxin Xu, Yaming Wu, Yaming Wu, } "Experimental study on roughness and flatness of micromirror fabricated by different anisotropic silicon etching processes", Proc. SPIE 6836, MEMS/MOEMS Technologies and Applications III, 683605 (4 January 2008); doi: 10.1117/12.768487; https://doi.org/10.1117/12.768487
PROCEEDINGS
7 PAGES


SHARE
Back to Top