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15 January 2008 New approach for 1w high output LED package using 3D lead frame
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Abstract
Currently, to package high power white LED almost use the manner of coating Phosphor over 40mil blue chip, in order to reduce heat dissipation, a new solution was brought about How to integrate small dies to achieve large die effect? This report will bring up a new manner to bond chips in vertical surface, break the traditionary packing manner.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zihua Liu "New approach for 1w high output LED package using 3D lead frame", Proc. SPIE 6841, Solid State Lighting and Solar Energy Technologies, 68410R (15 January 2008); https://doi.org/10.1117/12.756339
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