13 February 2008 Focus characterization for laser micromachining under real process conditions
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Abstract
The result in laser material processing is controlled mainly by the properties of the focused laser beam. Very special requirements have to be taken into account to characterize such a laser beam, which is finally used for laser micromachining. These specific aspects for the design of a beam diagnostics system ready to measure small spots (down the 10 micrometer range) at power densities up to several GW/cm2 will be discussed. Based on a CCD-camera concept, care has to be taken to magnify and to attenuate the beam properly. A special electronics design and algorithms are necessary to optimize the performance and finally to realize such a technical measuring system. Some applications of beam diagnostics within industrial processes (drilling holes, cutting wafers etc.) are demonstrated.
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Harald Schwede, Otto W. Märten, Reinhard Kramer, Stefan Wolf, Volker Brandl, "Focus characterization for laser micromachining under real process conditions", Proc. SPIE 6872, Laser Resonators and Beam Control X, 687208 (13 February 2008); doi: 10.1117/12.762675; https://doi.org/10.1117/12.762675
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