13 February 2008 Focus characterization for laser micromachining under real process conditions
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Abstract
The result in laser material processing is controlled mainly by the properties of the focused laser beam. Very special requirements have to be taken into account to characterize such a laser beam, which is finally used for laser micromachining. These specific aspects for the design of a beam diagnostics system ready to measure small spots (down the 10 micrometer range) at power densities up to several GW/cm2 will be discussed. Based on a CCD-camera concept, care has to be taken to magnify and to attenuate the beam properly. A special electronics design and algorithms are necessary to optimize the performance and finally to realize such a technical measuring system. Some applications of beam diagnostics within industrial processes (drilling holes, cutting wafers etc.) are demonstrated.
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Harald Schwede, Harald Schwede, Otto W. Märten, Otto W. Märten, Reinhard Kramer, Reinhard Kramer, Stefan Wolf, Stefan Wolf, Volker Brandl, Volker Brandl, } "Focus characterization for laser micromachining under real process conditions", Proc. SPIE 6872, Laser Resonators and Beam Control X, 687208 (13 February 2008); doi: 10.1117/12.762675; https://doi.org/10.1117/12.762675
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