13 February 2008 Enhanced microchannel cooling for high-power semiconductor diode lasers
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Abstract
The power consumption of semiconductor diode laser bars has continually increased in recent years while the heat transfer area for rejecting the associated thermal energy has decreased. As a result, the generated heat fluxes have become more intense making the thermal management of the laser systems more complicated. A common solution to this problem is to use the microchannel cooler, a small liquid enhanced heat sink capable of rejecting heat fluxes higher than those of finned air sinks of comparable size. The objective of this study is to improve and enhance heat transfer through an existing microchannel cooler using the computational fluid dynamics technique. A commercial software package is used to simulate fluid flow and heat transfer through the existing microchannel cooler, as well as to improve its designs. Three alternate microchannel designs are explored, all with hydraulic diameters on the order of 300 microns. The resulting temperature profiles within the microchannel cooler are analyzed for the three designs, and both the heat transfer and pressure drop performances are compared. The optimal microchannel cooler is found to have a thermal resistance of about 0.07°C-cm2/W and a pressure drop of less than half of a bar.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joe Dix, Joe Dix, Amir Jokar, Amir Jokar, Robert Martinsen, Robert Martinsen, } "Enhanced microchannel cooling for high-power semiconductor diode lasers", Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687606 (13 February 2008); doi: 10.1117/12.762172; https://doi.org/10.1117/12.762172
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