Translator Disclaimer
13 February 2008 Next-generation microchannel coolers
Author Affiliations +
A next-generation microchannel cooler has been developed for packaging laser diode arrays that eliminates many of the problems associated with typical copper-based cooling designs. The coolers are built on well-established Low-Temperature Cofired Ceramic technology and provide excellent thermal performance. They do not require the use of deionized water. This work highlights the strengths of the new cooler technology. The results of a long-term, high-flow-rate test which demonstrates the excellent erosion resistance of these coolers are presented. Three devices have been tested for 2500 hours at a flow rate of 0.25 GPM and show minimal signs of erosion. This data is compared to a similar test conducted with copper coolers. Several design parameters are also addressed for the ceramic coolers. The available form and fit characteristics are addressed, as is the custom-configurable nature of the devices.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryan Feeler, Jeremy Junghans, Greg Kemner, and Ed Stephens "Next-generation microchannel coolers", Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687608 (13 February 2008);

Back to Top