13 February 2008 Screening of high power laser diode bars in terms of stresses and thermal profiles
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Abstract
Within the project TRUST a total of about 600 actively cooled high power laser diode bars is analyzed. These devices are packaged by various project partners and by applying different packaging technologies. A number of analytical tools is applied to the devices, among others strain profiling by photocurrent spectroscopy. We present selected results such as the evolution of packaging-induced strains when advancing the technology from indium- to AuSn-soldering. The thermal properties of all devices are screened before the aging experiments by using thermal imaging. This involves monitoring of complete thermal profiles along each bar as well as the identification of "hot" emitters. These statistics turns out to be batch-specific and sensitive to the soldering technology used.
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Jens W. Tomm, Mathias Ziegler, Tran Quoc Tien, Fritz Weik, Petra Hennig, Jens Meusel, Heiko Kissel, Gabriele Seibold, Jens Biesenbach, Guenther Groenninger, Gerhard Herrmann, Uwe Strauß, "Screening of high power laser diode bars in terms of stresses and thermal profiles", Proc. SPIE 6876, High-Power Diode Laser Technology and Applications VI, 687619 (13 February 2008); doi: 10.1117/12.758877; https://doi.org/10.1117/12.758877
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