20 February 2008 Shallow hole drilling with ultrashort pulse lasers
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Proceedings Volume 6879, Photon Processing in Microelectronics and Photonics VII; 68790J (2008); doi: 10.1117/12.760630
Event: Lasers and Applications in Science and Engineering, 2008, San Jose, California, United States
Abstract
Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.
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B. R. Campbell, L. A. Forster, T. M. Lehecka, J. G. Thomas, V. V. Semak, "Shallow hole drilling with ultrashort pulse lasers", Proc. SPIE 6879, Photon Processing in Microelectronics and Photonics VII, 68790J (20 February 2008); doi: 10.1117/12.760630; https://doi.org/10.1117/12.760630
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KEYWORDS
Aluminum

Laser ablation

Pulsed laser operation

Picosecond phenomena

Laser drilling

Copper

Ultrafast phenomena

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