20 February 2008 Shallow hole drilling with ultrashort pulse lasers
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Proceedings Volume 6879, Photon Processing in Microelectronics and Photonics VII; 68790J (2008); doi: 10.1117/12.760630
Event: Lasers and Applications in Science and Engineering, 2008, San Jose, California, United States
Using a picosecond laser system that can operate at 1064, 532, 355, and 266nm wavelengths, experiments were conducted with polished metal samples to study material removal from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of wavelength, energy and a double pulse exposure method were examined. Results were compared with simulations that model the material removal rates from ultrashort pulse drilling.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. R. Campbell, L. A. Forster, T. M. Lehecka, J. G. Thomas, V. V. Semak, "Shallow hole drilling with ultrashort pulse lasers", Proc. SPIE 6879, Photon Processing in Microelectronics and Photonics VII, 68790J (20 February 2008); doi: 10.1117/12.760630; https://doi.org/10.1117/12.760630


Laser ablation

Pulsed laser operation

Picosecond phenomena

Laser drilling


Ultrafast phenomena

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