Optoelectronic packaging based on laser joining

Ramona Eberhardt; Erik Beckert; Thomas Burkhardt; Steffen Böhme; Thomas Schreiber; Andreas Tünnermann

doi:10.1117/12.763105

23 February 2008 Optoelectronic packaging based on laser joining

Ramona Eberhardt, Erik Beckert, Thomas Burkhardt, Steffen Böhme, Thomas Schreiber, Andreas Tünnermann

Proceedings Volume 6880, Laser-based Micro- and Nanopackaging and Assembly II; 68800G (2008) https://doi.org/10.1117/12.763105
Event: Lasers and Applications in Science and Engineering, 2008, San Jose, California, United States

Abstract

Laser based joining technologies for optical assemblies overcome the limitations of standard fixation technologies such as adhesive or wafer level bonding. By applying the laser energy locally and for a limited time these technologies enable for higher stability of optical joints as well as additional functionality. Working without intermediate layers laser splicing creates highly stable transparent joints that are suitable for the transmission of high power, e.g. in fiber laser assemblies. In contrast, laser beam soldering of optical components as an alternative with a metallic intermediate layer is non-transparent, but creates flexible and stress-compensating joints as well as thermal and electrical interconnects.

Citation Download Citation

Ramona Eberhardt, Erik Beckert, Thomas Burkhardt, Steffen Böhme, Thomas Schreiber, and Andreas Tünnermann "Optoelectronic packaging based on laser joining", Proc. SPIE 6880, Laser-based Micro- and Nanopackaging and Assembly II, 68800G (23 February 2008); https://doi.org/10.1117/12.763105

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