26 February 2008 Micro-inductors integrated on silicon for DC-DC converters
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Proceedings Volume 6882, Micromachining and Microfabrication Process Technology XIII; 68820A (2008); doi: 10.1117/12.763085
Event: MOEMS-MEMS 2008 Micro and Nanofabrication, 2008, San Jose, California, United States
Abstract
For applications such as computers, cellular telephones and Microsystems, it is essential to reduce the size and the weight of DC-DC converters. To miniaturize passive components, micromachining techniques provide solutions based on low-temperature process compatible with active part of the converter. This paper deals with the integration on silicon of "spiral-type" inductor topology. Electroplating techniques are used to achieve the copper conductor and the CoNiFe laminated magnetic core and several investigations on the electroplating bath's parameters have been realized in order to obtain the adequate magnetic properties. Finally, a 1μH micro-inductor prototype has been characterized.
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T. El Mastouli, J.P. Laur, J.L. Sanchez, M. Brunet, D. Bourrier, M. Dilhan, "Micro-inductors integrated on silicon for DC-DC converters", Proc. SPIE 6882, Micromachining and Microfabrication Process Technology XIII, 68820A (26 February 2008); doi: 10.1117/12.763085; http://dx.doi.org/10.1117/12.763085
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KEYWORDS
Magnetism

Chemical mechanical planarization

Electroplating

Copper

Prototyping

Inductance

Resistance

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