22 February 2008 Review: fine embossing of novel glasses for photonic integrated circuits
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Proceedings Volume 6890, Optical Components and Materials V; 689007 (2008); doi: 10.1117/12.760888
Event: Integrated Optoelectronic Devices 2008, 2008, San Jose, California, United States
Abstract
Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (Tg) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm -scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.
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A. B. Seddon, D. Furniss, W. J. Pan, P. Sewell, A. Loni, Y. Zhang, T. M. Benson, "Review: fine embossing of novel glasses for photonic integrated circuits", Proc. SPIE 6890, Optical Components and Materials V, 689007 (22 February 2008); doi: 10.1117/12.760888; https://doi.org/10.1117/12.760888
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KEYWORDS
Glasses

Silicon

Waveguides

Gallium arsenide

Photomicroscopy

Chalcogenide glass

Photonic integrated circuits

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