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13 February 2008 Silicon photonic integration for high-speed applications
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Photonic integration is one of the important ways to realize low cost and small form factor optical transceivers for future high-speed high capacity I/O applications in computing systems. The photonic integration on silicon platform is particularly attractive because of the CMOS photonics and electronics process compatibility. In this paper, we present design and fabrication of a silicon photonic integrated circuit that is capable of transmitting data at hundreds gigabits per second. In such an integrated chip, 8 high-speed silicon optical modulators with a 1:8 wavelength demultiplexer and an 8:1 wavelength multiplexer are fabricated on a single silicon-on-insulator (SOI) substrate. We review the recent results of individual silicon modulator based on electric-field-induced carrier depletion in a SOI waveguide containing a reverse biased pn junction. We characterize the individual multiplexer/demultiplexer as well as the integrated chip. The basic functionality of the photonic integration is demonstrated.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ansheng Liu, Ling Liao, Doron Rubin, Juthika Basak, Yoel Chetrit, Hat Nguyen, D. W. Kim, Assia Barkai, Richard Jones, Nomi Elek, Rami Cohen, Nahum Izhaky, and Mario Paniccia "Silicon photonic integration for high-speed applications", Proc. SPIE 6898, Silicon Photonics III, 68980D (13 February 2008);


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