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6 February 2008 Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications
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Abstract
We describe our R & D on optoelectronic packaging technologies such as the optical backplane utilizing 300 pieces of the high index contrast fine multimode fibers and the low-cost and high-density OE-conversion parallel link modules operating at 10 Gbps /ch for less than 1 m regime applications. Combination of the developed backplane and the modules implies potential of 3 Tbps aggregate throughputs at the board-to-board level optical interconnections. We also introduce novel component technologies for low-cost and high-density optical coupling between optical devices. These technologies include the monolithic two wavelengths twin VCSELs and easy self-alignment coupling technology capable of alleviating difficulties for optics penetration inside the box.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takashi Mikawa "Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 689902 (6 February 2008); https://doi.org/10.1117/12.764197
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