8 February 2008 Merging parallel optics packaging and surface mount technologies
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Abstract
Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.
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Christophe Kopp, Marion Volpert, Julien Routin, Stéphane Bernabé, Cyrille Rossat, Myriam Tournaire, Régis Hamelin, "Merging parallel optics packaging and surface mount technologies", Proc. SPIE 6899, Photonics Packaging, Integration, and Interconnects VIII, 68990Y (8 February 2008); doi: 10.1117/12.761609; https://doi.org/10.1117/12.761609
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