24 March 2008 Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image
Author Affiliations +
Abstract
In this paper, we propose a novel defect inspection method by considering the advantage that the same pattern is repeatedly transferred onto a large number of areas in resist pattern fabrication. This approach consists of following two steps. The first step is to obtain a high-resolution pattern image from multiple low-resolution images of the same pattern on an observed noisy SEM image using a reconstruction-based super-resolution technique where the B-spline interpolation is utilized. It can reconstruct a high-resolution image from the low resolution and noisy images with a high degree of accuracy. The next step is to inspect defects by comparing the high-resolution pattern image with lowresolution images to be verified. We applied our method to model and SEM images to show its validity.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masahiko Takashima, Masahiko Takashima, Yoshihiro Midoh, Yoshihiro Midoh, Koji Nakamae, Koji Nakamae, } "Defect inspection using a high-resolution pattern image obtained from multiple low-resolution images of the same pattern on an observed noisy SEM image", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692216 (24 March 2008); doi: 10.1117/12.772513; https://doi.org/10.1117/12.772513
PROCEEDINGS
11 PAGES


SHARE
RELATED CONTENT


Back to Top