A new high-resolution photomask inspection system for contamination detection

Bo Mu; Aditya Dayal; Lih-Huah Yiin; Jinggang Zhu; John Miller; Gregg Inderhees

doi:10.1117/12.773201

24 March 2008 A new high-resolution photomask inspection system for contamination detection

Bo Mu, Aditya Dayal, Lih-Huah Yiin, Jinggang Zhu, John Miller, Gregg Inderhees

Proceedings Volume 6922, Metrology, Inspection, and Process Control for Microlithography XXII; 69222B (2008) https://doi.org/10.1117/12.773201
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

STARlight2+^TM (SL2+) is a new high-resolution contamination inspection system based upon the KLA-Tencor TerascanHR platform. Building upon the proven technology of STARlight^TM (SL2), SL2+ uses transmitted and reflected images to detect potentially yield-limiting contamination defects on photomasks for wafer fabs and mask shops. It extends the contamination inspection capability to the 32nm logic/45nm Half Pitch (HP) technology nodes using the newly developed 72nm pixel image resolution as well as a significantly improved rendering model in the algorithm. In this paper, we present inspection results on a wide variety of photomasks, spanning the 32nm to 110nm technology nodes, in the recently concluded period of Alpha tests on the SL2+ system. The test results show that the sensitivity and the inspection capability of the new SL2+ system have been greatly improved. Such improvement enables wafer fabs and mask shops to inspect and qualify photomasks for 32nm node development and 45nm node production.

Citation Download Citation

Bo Mu, Aditya Dayal, Lih-Huah Yiin, Jinggang Zhu, John Miller, and Gregg Inderhees "A new high-resolution photomask inspection system for contamination detection", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69222B (24 March 2008); https://doi.org/10.1117/12.773201

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