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24 March 2008 A new high-resolution photomask inspection system for contamination detection
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Abstract
STARlight2+TM (SL2+) is a new high-resolution contamination inspection system based upon the KLA-Tencor TerascanHR platform. Building upon the proven technology of STARlightTM (SL2), SL2+ uses transmitted and reflected images to detect potentially yield-limiting contamination defects on photomasks for wafer fabs and mask shops. It extends the contamination inspection capability to the 32nm logic/45nm Half Pitch (HP) technology nodes using the newly developed 72nm pixel image resolution as well as a significantly improved rendering model in the algorithm. In this paper, we present inspection results on a wide variety of photomasks, spanning the 32nm to 110nm technology nodes, in the recently concluded period of Alpha tests on the SL2+ system. The test results show that the sensitivity and the inspection capability of the new SL2+ system have been greatly improved. Such improvement enables wafer fabs and mask shops to inspect and qualify photomasks for 32nm node development and 45nm node production.
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Bo Mu, Aditya Dayal, Lih-Huah Yiin, Jinggang Zhu, John Miller, and Gregg Inderhees "A new high-resolution photomask inspection system for contamination detection", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69222B (24 March 2008); https://doi.org/10.1117/12.773201
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