Sensitivity and performance estimates for the multiple wavelength multiple incidence angle ellipsometry for OCD applications

Michael Kotelyanskii; Gary Jiang

doi:10.1117/12.772682

16 April 2008 Sensitivity and performance estimates for the multiple wavelength multiple incidence angle ellipsometry for OCD applications

Michael Kotelyanskii, Gary Jiang

Author Affiliations +

Proceedings Volume 6922, Metrology, Inspection, and Process Control for Microlithography XXII; 69223O (2008) https://doi.org/10.1117/12.772682
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Optical metrology techniques are essential for process control of the gate formation process steps from lithography to the dielectric, spacers, gate and straining layer deposition in the sub-65nm technology nodes. Traditionally, optical metrology is based on the measurements of periodic lines or hole arrays using a spectroscopic ellipsometer or reflectometer, collecting data across a wavelength range at a single angle of incidence. In this paper, we discuss measurements using Focused Beam Ellipsometry (FBE), illuminating at discrete laser wavelengths while data is collected over a wide angle of incidence range. We verify precision estimates of the different model parameters with actual values obtained from measured data. We show sensitivity ranges for different applications over the space of measured wavelength spectrum from DUV to IR, angle of incidence range, and sample azimuthal orientations. Major factors contributing to the projected recipe performance - wavelength, orientation of the incident beam are discussed.

Citation Download Citation

Michael Kotelyanskii and Gary Jiang "Sensitivity and performance estimates for the multiple wavelength multiple incidence angle ellipsometry for OCD applications", Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 69223O (16 April 2008); https://doi.org/10.1117/12.772682

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