It has been found that 193nm immersion lithography technology can achieve smaller patterns without any
modification to the technology infrastructure of existing state-of-the-art 193nm dry lithography. This has made 193nm
immersion lithography a promising technology for mass production processes. Recently, scanning speed of the exposure
stage has been increasing in order to achieve high throughput for mass production. At present, the adoption of a topcoat
is one of the promising candidates for this high speed scanning process. On the other hand, the demand for a non-topcoat
process is being pursued from a C.O.O. (cost of ownership) point of view but there are still issues being revealed and
concerns to be solved. In this report, feasibility of a comprehensive process for high scanning ArF immersion lithography was discussed. As for the topcoat process, a high receding contact angle topcoat, such as TC-A (JSR), is proving to be a good candidate for mass production using high scanning speed immersion lithography. TC-A has a similar defectivity and lithographic performance to TCX041 (JSR). On the other hand, the feasibility of a non-topcoat process was also investigated. CD uniformity, defectivity and lithography performance of AIM5120JN and AIM5570JN (JSR) data indicate that the non-topcoat process can be adopted for mass production process. An immersion cluster comprised of a high volume production immersion exposure tool, S610C (NIKON) having 1.3 NA and CLEAN TRACKTM LITHIUSTM i+ (TEL) track system were used in this study.