DfM, the teenage years

Lars Liebmann

doi:10.1117/12.782650

19 March 2008 DfM, the teenage years

Lars Liebmann

Proceedings Volume 6925, Design for Manufacturability through Design-Process Integration II; 692502 (2008) https://doi.org/10.1117/12.782650
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

To quantify current DfM value and future DfM potential, a mathematical framework to compare the DfM opportunity of present and future technology nodes is derived. Parallels are drawn between the evolution of DfM and the transition from 'soft RET' to 'hard RET'. DfM accomplishments in the current 'soft DfM' era are presented as compiled from a DfM workshop held by IBM's technology development partners. IBM's vision of profitable CMOS scaling in the era of 'hard DfM' is presented and its core computational technology elements are discussed. Feasibility demonstrations of key technical elements are reviewed. The paper shows that current technology nodes benefit from the emergence of integrated DfM solutions that provide incremental yet hard to quantify yield and performance benefits but also argues that DfM's role will continue to grow as computational scaling replaces physical scaling in the not to distant future.

Citation Download Citation

Lars Liebmann "DfM, the teenage years", Proc. SPIE 6925, Design for Manufacturability through Design-Process Integration II, 692502 (19 March 2008); https://doi.org/10.1117/12.782650

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