High electromechanical performance of electroelastomers based on interpenetrating polymer networks

Soon Mok Ha; Il Seok Park; Michael Wissler; Ron Pelrine; Scott Stanford; Kwang J. Kim; Gabor M. Kovacs; Qibing Pei

doi:10.1117/12.778282

10 April 2008 High electromechanical performance of electroelastomers based on interpenetrating polymer networks

Soon Mok Ha, Il Seok Park, Michael Wissler, Ron Pelrine, Scott Stanford, Kwang J. Kim, Gabor M. Kovacs, Qibing Pei

Author Affiliations +

Proceedings Volume 6927, Electroactive Polymer Actuators and Devices (EAPAD) 2008; 69272C (2008) https://doi.org/10.1117/12.778282
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2008, San Diego, California, United States

Abstract

The electromechanical performance of interpenetrating polymer networks (IPN) in which one elastomer network is under high tension balanced by compression of the second network, were investigated. Uniaxial stress relaxation analysis confirmed significant decrease in viscoelasticity in comparison with 3M VHB films, the primary component network in the IPN films. In dynamic mechanical analysis, the IPN composite showed a higher mechanical efficiency, suggesting delayed relaxation of the acrylic chains in the presence of IPN formation. This improvement was found to be dependant on the contents of poly(TMPTMA). Actuation performance without mechanical prestrain showed that these IPN electroelastomers had demonstrated high elastic strain energy density (3.5 MJ/m³) and a high electromechanical coupling factor (93.7%). These enhanced electromechanical performances indicate that IPN electroelastomer should be suitable for diverse applications.

Citation Download Citation

Soon Mok Ha, Il Seok Park, Michael Wissler, Ron Pelrine, Scott Stanford, Kwang J. Kim, Gabor M. Kovacs, and Qibing Pei "High electromechanical performance of electroelastomers based on interpenetrating polymer networks", Proc. SPIE 6927, Electroactive Polymer Actuators and Devices (EAPAD) 2008, 69272C (10 April 2008); https://doi.org/10.1117/12.778282

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