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5 March 2008 Silicon optical bench for flip-chip integration of high speed widely tunable lasers
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Proceedings Volume 7009, Second International Conference on Advanced Optoelectronics and Lasers; 700904 (2008) https://doi.org/10.1117/12.793290
Event: Second International Conference on Advanced Optoelectronics and Lasers, 2005, Yalta, Ukraine
Abstract
A silicon optical bench for flip chip mounted widely tunable modulated-grating Y-branch lasers is presented. Its impact on the static and dynamic performance of the laser device is evaluated and compared with a conventional aluminium nitride carrier. The carriers exhibited similar thermal and static performance but the dynamic performance was limited by the electrode layout and the higher microwave losses of the silicon optical bench. With improved microwave design of the electrodes, flip-chip mounting on a silicon optical bench is promising for low cost assembly of high-speed multi-electrode devices.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Chacinski, A. Scholes, R. Schatz, P. Ericsson, M. Isaksson, and S. Hammerfeldt "Silicon optical bench for flip-chip integration of high speed widely tunable lasers", Proc. SPIE 7009, Second International Conference on Advanced Optoelectronics and Lasers, 700904 (5 March 2008); https://doi.org/10.1117/12.793290
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