19 May 2008 Phase shift mask etch process development utilizing a scatterometry-based metrology tool
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Proceedings Volume 7028, Photomask and Next-Generation Lithography Mask Technology XV; 702807 (2008) https://doi.org/10.1117/12.793016
Event: Photomask and NGL Mask Technology XV, 2008, Yokohama, Japan
Phase, along with defect levels and CD, must be closely monitored on 45nm technology node masks. The final phase shift of a mask is highly dependent on the ability of the etch tool to stop at precisely the correct depth. Developing etch processes and endpoint recipes for successful phase shift processing depends on rapid and accurate measurement of etch depth. In many mask shops, these measurements are made by either direct phase measurement tools or atomic force microscopes (AFM). These tools have relatively low throughput. In the case of the direct phase measurement tool, the large measurement spot size precludes the measurement of the small features most interesting to mask makers. A need exists for a relatively fast measurement tool that can be applied to features <1μm in size. As part of Oerlikon USA's continuous etch process improvement efforts, the etch depth measurement capabilities of a scatterometry based metrology tool were explored. Phase shift masks (one EAPSM, one AAPSM) were created to act as standards for our experiments. Regions of each mask were etched to various depths using an Oerlikon Mask Etcher system, and then measured with both a commercial AFM and an n&k Technology 1700-RT scatterometry tool. Using this data, recipes capable of measuring quartz trench features, partially-etched MoSi trench features, and bulk MoSi films were developed on the n&k 1700-RT. Phase uniformity data taken from actual etch experiments will be provided, as well as data showing the repeatability of each system, and a comparison of the relative measurement times.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jason Plumhoff, Jason Plumhoff, Alexander Gray, Alexander Gray, } "Phase shift mask etch process development utilizing a scatterometry-based metrology tool", Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 702807 (19 May 2008); doi: 10.1117/12.793016; https://doi.org/10.1117/12.793016

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