Translator Disclaimer
19 May 2008 Die-to-database mask inspection with variable sensitivity
Author Affiliations +
Proceedings Volume 7028, Photomask and Next-Generation Lithography Mask Technology XV; 70282I (2008) https://doi.org/10.1117/12.793088
Event: Photomask and NGL Mask Technology XV, 2008, Yokohama, Japan
Abstract
The cost of mask is increasing dramatically along with the continuous semiconductor scaling. ASET started a 4-year project to reduce mask manufacturing cost and TAT by optimizing Mask Data Preparation (MDP), mask writing, and mask inspection in 2006, with the support from the New Energy and Industrial Technology Development Organization (NEDO). We report on the development of a new low cost mask inspection technology with short Turn Around Time (TAT), as a result of adopting a method of selecting defect detection sensitivity level for every local area, defined by such factors as defect judgment algorithm and defect judgment threshold, as one of the pseudo-defect-reduction technique necessary to shorten mask inspection TAT. Those factors are extracted from the database of Mask Data Rank (MDR) and converted on the basis of pattern prioritization determined at device design stage, using parallel computation.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideo Tsuchiya, Masakazu Tokita, Takehiko Nomura, and Tadao Inoue "Die-to-database mask inspection with variable sensitivity", Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 70282I (19 May 2008); https://doi.org/10.1117/12.793088
PROCEEDINGS
8 PAGES


SHARE
Advertisement
Advertisement
Back to Top