17 February 1987 A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment
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Proceedings Volume 0703, Integration and Packaging of Optoelectronic Devices; (1987) https://doi.org/10.1117/12.965188
Event: Cambridge Symposium-Fiber/LASE '86, 1986, Cambridge, MA, United States
Abstract
A packaging technique that enables a low-loss optical couple between a single-mode laser diode and a single-mode optical fiber has been developed. The technique uses a miniature thin-film substrate with an onboard resistor to mount and subsequently align a lensed and metallized fiber to an emitting laser diode. The resistor serves as a local heat source to first effect the attachment of the fiber to the substrate and second to effect the attachment of the fiber-substrate assembly into aligned position with the laser. Thermal stability of optical couples made with this technique is demonstrated.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott Enochs, "A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment", Proc. SPIE 0703, Integration and Packaging of Optoelectronic Devices, (17 February 1987); doi: 10.1117/12.965188; https://doi.org/10.1117/12.965188
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