Paper
17 February 1987 A Reliable Package For Hermetic Encapsulation Of Ingaasp Edge Emitting Leds
C. L. Reynolds Jr., S. F. Nygren, R. L. Lapinsky, R. C. Vehse, M. G. Brown
Author Affiliations +
Proceedings Volume 0703, Integration and Packaging of Optoelectronic Devices; (1987) https://doi.org/10.1117/12.965185
Event: Cambridge Symposium-Fiber/LASE '86, 1986, Cambridge, MA, United States
Abstract
A reliable package for edge emitting LEDs has been developed, and the assembly and characteristics are described. This package is easily fabricated, hermetic, and provides excellent coupling stability between the chip and single mode fiber. A minimum of 7,447 of coupled power into single mode fiber is typically achieved, and long-term aging indicates less than 1dB change in light output after 2000 hrs at 90°C.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. L. Reynolds Jr., S. F. Nygren, R. L. Lapinsky, R. C. Vehse, and M. G. Brown "A Reliable Package For Hermetic Encapsulation Of Ingaasp Edge Emitting Leds", Proc. SPIE 0703, Integration and Packaging of Optoelectronic Devices, (17 February 1987); https://doi.org/10.1117/12.965185
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Light emitting diodes

Single mode fibers

Optoelectronic devices

Lead

Optoelectronic packaging

Packaging

Resistance

Back to Top