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10 September 2008 Accelerated test for effect of moisture and temperature on glass-encapsulant interface
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Abstract
For rigid photovoltaic (PV) cell encapsulation, durable adhesion of the polymeric encapsulant to glass is one of the most important considerations in developing a reliable PV module. The great challenge for encapsulant materials is to obtain adhesion that survives humidity stress at high temperature, since all organic polymers are to some degree permeable to water vapor and water molecules can migrate to the interface and degrade the adhesion. Several test methods were used to accelerate the adhesion degradation process for materials screening. Solar grade EVA and several experimental encapsulant materials were used for the study, which included a detailed analysis of the combined role of moisture and temperature in inducing loss of adhesion. The effect of moisture and temperature on adhesion mechanisms and polymer properties will be discussed.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shaofu Wu, Josh Chen, Bert Weaver, Bill Sumner, and Victor Juarez "Accelerated test for effect of moisture and temperature on glass-encapsulant interface", Proc. SPIE 7048, Reliability of Photovoltaic Cells, Modules, Components, and Systems, 70480B (10 September 2008); https://doi.org/10.1117/12.795935
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